TAZMO
Advanced Packaging and Power Devices for the Semiconductor Industry

Since its establishment in 1972, TAZMO has continued to provide equipment that contributes to the automation of processing in device manufacturing based on chemical coating technology and wafer transfer technology. The company’s four core businesses are temporary bonding and debonding (TBDB) equipment and thick film coating/developing equipment, wafer handling transfer robots, cleaning equipment for wafer manufacturing processes, and coating equipment for FPD.

For the semiconductor production in Japan and the demand for localization of semiconductors manufacturing equipment, TAZMO started the development of resist coating equipment in 1979. “In the 1980s, we jointly developed loader units with a pre-aligner for steppers with a device manufacturer,” says Mr. Yasuyuki Sato, the executive vice president of TAZMO. Since then, the company has expanded its business by manufacturing and marketing various process equipment in collaboration with device makers and material makers and by marketing wafer handling robots.

TAZMO has been developing the TBDB equipment since 2004, which has been widely used in the mass production of advanced packaging and power device where various processes are performed using thinned wafers.

As for the debonding of wafer support, the company provides a debonding tool that utilizes a unique differential pressure technology, which can be used to debond wafer support from wafers with a thickness of 30 μm or thinner in addition to the laser debonding tool.

With its focus on advanced packaging and power devices, TAZMO TBDB equipment is used when advanced packagingtechnologies represented by Fan-out wafer-level packaging (FOWLP), 2.5D, and 3D Integration are applied to products. “We believe that its application and importance of TBDB technology will further increase in the future,” states Mr. Yasuyuki. Furthermore, the discrete power electronics market, such as MOSFET and IGBT, which are indispensable for reducing power consumption and driving efficiently, continues to expand. Capital investment in 200 mm and 300 mm mass production lines is accelerating. Based on these trends, TAZMO provides a group of equipment that can cover multiple processes from bonding to debonding and cleaning and provide services that enable optimization before and after the process to meet diverse needs.

TAZMO’s TBDB process development begins with the development, selection, and evaluation of new materials. Besides technical capabilities, experience is requiredto build a mass production line according to the conditions of wafers.

Coating technology for high-viscosity materials such as adhesives, resist, and polyimide, and handling and processing of thick and warped wafers such as wafers with supports and molded wafers are indispensable technologies for automating this process.

TAZMO receives samples from material manufacturers at the development stage, develops equipment suitable for the material and new bonding and debonding methods on its own. As a result, both high yield and mass productivity can be achieved.

What differentiates TAZMO is its strategy of responding to diversified individual issues and demands from device manufacturers such as Foundry and OSAT in the niche backend-process (BEOL) market. “We will further enhance our competitiveness and promote it by automating with wet treatment and handling technology that we have cultivated since the establishment of the company,” mentions Mr. Yasuyuki.